Recommended Design Rules and Strategies for BGA Devices User Guide (UG1099)

Document ID: UG1099
Release Date: 2022-11-23
Revision: 2.0 English

Introduction
General BGA and PCB Layout Overview
Layer Count Estimation and Optimization
Layer Count Optimization
Fabrication Technologies
Maximum Board Thickness and Aspect Ratio
Recommended BGA Ball Pad, Via, and Trace Dimensions for 1.0mm, 0.92mm, 0.8mm, and 0.5mm Devices
Power Delivery to the FPGA
PCB Routing for Remote Voltage Sense Lines
Purpose of Sense Lines
Limitations of Sense Lines
ACAPs with Dedicated Sense Pins
ACAPS without Dedicated Sense Pins
The Use of Routing Tunnels and Sense Lines
Sample Breakouts for 1.0 mm, 0.92, and 0.8mm Pitch Devices
Sample Breakout for 0.5 mm Pitch Devices
Additional Resources and Legal Notices
Xilinx Resources
Documentation Navigator and Design Hubs
References
Revision History
Please Read: Important Legal Notices

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