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Rockwell Collins Uses Zynq UltraScale+ RFSoC Devices in Revolutionizing How Arrays are Produced and Fielded: Powered by Xilinx

Rockwell Collins is the safe and reliable choice for avionics and defense companies. Under the DARPA Arrays and Commercial Timescales Program, Rockwell Collins is revolutionizing the way that arrays are produced and fielded. Using Xilinx Zynq® UltraScale+™ RFSoC devices, Rockwell Collins has created a common module that can be used for a wide range of applications and over a wide range of frequencies.

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Clarius Mobile Health Portable Ultrasound: Powered by Xilinx

Clarius Mobile Health’s revolutionary portable ultrasound systems enable doctors to see an ultrasound at a moment’s notice through a handheld machine that provides high performance imaging in a small form factor.

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Xilinx Introduces PAM4-Capable Virtex UltraScale+ FPGAs

Learn about how Xilinx has integrated 58Gb/s PAM4 transceivers into the 16nm Virtex® UltraScale+™ portfolio. Built on industry leading high-end FPGAs, these new devices double bandwidth on existing infrastructure for Data Center Interconnect, 5G infrastructure and Networking, Test & Measurement, and Aerospace & Defense applications, providing seamless migration of existing systems to next-gen backplane, optics, and high performance interconnects.

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Bitmain Technologies Bitcoin Mining: Powered by Xilinx

Bitmain produces Bitcoin mining machines along with the largest mines and hash rate tradeoff platform products plus services for the virtual currency mining industry. Low power mining machines. Zynq SoCs act as the master control system for Bitmain’s mining machines, offering high performance at a low BOM cost.

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Metoak Technology Visual Sensors for ADAS and Autonomous Driving: Powered by Xilinx – Demo Shorts

Metoak Technology demonstrates their onboard visual sensing module for ADAS and autonomous vehicle with features such as the ability to detect the drivable zone of a vehicle in real time. The module leverages the parallel processing capabilities of Zynq SoCs to enable high performance and low latency 3D deep sensing computation.

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