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Zynq UltraScale+ RFSoC DFE ZCU670 Evaluation Kit

The Zynq® UltraScale+™ RFSoC DFE ZCU670 Evaluation Kit is the optimal platform for adaptive radio development and out-of-box evaluation in rapid prototyping of 5G New Radio (5G NR), radar, and a breadth of RF applications. This product is available to qualified customers. Please contact your local sales representative or visit the contact sales form.

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Overview

This product is in early access with availability to qualified customers.
Contact your local sales representative to learn how to join the early access program.

Product Description

The Zynq RFSoC DFE ZCU670 Evaluation Kit is a superb RF 5G wireless test platform for both out-of-box evaluation and rapid prototyping of RF applications for 5G NR and radar.

The kit features the Zynq UltraScale+ RFSoC DFE device featuring integrated RF data converters and a breadth of power-efficient 5G NR cores for a complete hardened radio subsystem. As an adaptive SoC, the device features programmable logic for hardware differentiation and adaptability to future market requirements.


Key Features & Benefits

Target Applications

  • Wireless: 5G massive-MIMO, multi-mode macrocell, mmWave radio as IF transceiver, small cell nodes
  • Aerospace & Defense
  • Test & Measurement

Industry’s only adaptable radio platform, now with hardened 5G NR cores

  • A monolithic, analog, and digital device based on 16nm TSMC process
  • Integrated 8T8R RF data converters for 7.125GHz direct-RF bandwidth and 400MHz instantaneous bandwidth (iBW)
  • Power-optimized 5G NR cores including DUC, DDC, DPD, CFR, and Low-PHY processing IP
  • UltraScale+ programmable logic for hardware differentiation and adaptability to future market requirements and use cases
  • Arm® processing subsystem for RF calibration, digital pre-distortion (DPD) processing, and more

Connectivity Options for Rapid Application Development 

  • DDR4 Component – 4GB, 64-bit, 2666MT/s, connectivity to programmable logic (PL)
  • DDR4 SODIMM – 4GB 64-bit, 2400MT/s, connectivity to processing subsystem (PS)
  • Quad zSFP/zSFP+ cage assembly

Mezzanine Cards and Reference Designs for Expandability

  • FMC+ connector enabling I/O expansion, with connectivity to 34 differential I/O signals and 12x 32Gb/s transceiver I/O
  • XM650 RFMC 2.0 card for N79 band loopback, enabling out-of-the-box loopback and example reference layout for baluns
  • XM755 RFMC 2.0 breakout card for in-depth lab-based measurements, including multi-tile synchronization (MTS)

Featured Xilinx Devices

Featuring the Zynq RFSoC DFE XCZU67DR-2FSVE1156I

14-bit, 2.9GSPS RF-ADC 8
14-bit, 5.9GSPS RF-ADC 2
14-bit, 10GSPS RF-DAC 10
DFE Integrated
System Logic Cells (K) 489
Memory (Mb) 67.8
DSP Slices 1,872
28.21Gb/s Transceivers 8*
Maximum I/O Pins 154


 

Zynq Gen 3

* A subset of the available I/Os and transceivers on the silicon device are mapped on the kit. Please reference the Board User Guide for actual mapping.

NOTE: The table shows max specifications for the device independent of the board. Please refer to the Board User Guide for specifications of the device on the board.

Product Information

Specifications

Board Features

Featuring the Zynq® RFSoC DFE XCZU67DR-2FSVE1156I

ZCU670 board
Board Specifications Value
Height 12.225 inch (31.05 cm)
Width 10.675 inch (27.11 cm)
Thickness (+/-5%) 0.119 inch (0.302 cm)
Operating Environmental Temperature 0C to +45C
Storage Environmental Temperature -25C to +60C
RF Data Converter
# of 14-bit RF-ADCs @ 2.95 GSPS 8
# of 14-bit RF-ADCs @ 5.9 GSPS 2
# of 14-bit RF-DACs @ 10* GSPS 10
Memory
PS DDR4 4GB 64-bit SODIMM
PL DDR4 4GB 64-bit Component
MicroSD Card 16GB
QSPI 4GB
Communications & Networking
USB (UART/JTAG) 1
RJ-45 1
SFP28 4
USB 3.0 1
Expansion Connectors
FMC+ 1
RFMC 2.0 2
CLK104 Connector (card not included) 1
Add-on Cards
XM650 1
XM755 1
Control & I/O
DIP Switches 2
LEDs 4
Push Buttons 6
I2C 2
PMBus 1
JTAG PC4 Header 1
Boot Options
SD Boot Yes
QSPI Boot Yes
JTAG Boot Yes
Power
12V Wall Adapter Yes
ATX Power Compatible Yes

* -2I speed grade silicon

What’s Inside

What's Inside the Box

What's inside the box

Resources

Documentation

Featured Documents

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Tools

Design Tools

  • Vivado® ML Enterprise Edition: The EDA tool suite to create projects for the ZCU670 board. Node-locked and device-locked to the Zynq® UltraScale+™ XCZU67DR RFSoC DFE with one year of updates.
  • Vitis™ Unified Software Platform: The full suite of tools for developing embedded software, debugging RFSoC DFE devices, and running targeted reference designs and example designs.

PetaLinux Tools, Board Support Packages, and Pre-Built Images

Additional Tools

  • RF Analyzer: A board-independent debugging tool for all Zynq UltraScale+ RFSoC devices
  • Power Advantage Tool: A tool to measure power data and control power-related features in a design
Getting Started

Getting Started with the ZCU670 Evaluation Kit

Visit the wiki page to jump-start prototyping and cutting-edge RF application development with the ZCU670 Evaluation Kit.

The Quick Start Guide includes:

  • How to setup the ZCU670 board and information on kit components
  • Using the System Controller UI to configure the board
  • Working with the RF Analyzer to check the RF performance of the silicon and board 
Get Started
Training & Support
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