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Missiles & Munitions

Defense contractors and agencies need the power of programmability to develop state-of-the-art capabilities while leveraging design resources across platforms in the global missiles and munitions (M&M) market. For more than two decades, Xilinx has helped M&M project teams meet—and exceed—mission requirements with the flexibility and integration capabilities of FPGAs.

The broad Xilinx portfolio of commercial and defense-grade devices makes it easy to match the right product to each project. Clear migration paths let developers get started today with the latest 7 series devices including the Xilinx Zynq™-7000 All Programmable SoC family. With industry-leading levels of integration, Xilinx programmable devices enable the rapid delivery of complex capabilities with reduced risk.

A Path to Next-Generation Missiles and Munition Applications

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Xilinx FPGAs provide reprogrammability and high performance for motor control, sensor inputs, signal processing, gimbal functions and more. The latest Xilinx device families, with a 4X improvement in bandwidth, provide advanced signal processing power for the most sophisticated systems.

High-Performance, Ultra-Low-Power Signal Processing

Xilinx COTS and defense-grade devices meet the connectivity and power requirements for most M&M applications including guidance, control, targeting, and communications applications. Latest 7 series and Zynq SOC built on the statdefensee-of-the-art 28nm HPL process provide the ideal solutions:

Programmable System Integration

Integration of functions is continuing to increase.  The 2x capacity of Virtex®-7 increase over competing solutions will push integration to new heights.

Increased System Performance

Increased performance of Virtex-7 allows greater situational awareness and improved target engagement envelope.

BOM Cost Reduction

  • Scale device size/cost for different end-product derivatives
  • Reduces BOM cost by 45% from V6 to V7

Total Power Reduction

On-gimbal electronics cannot be cooled by conventional means due to mechanical isolation and vacuum environment.  22% power reduction of 7 series over previous generations.

Accelerated Design Productivity & TTM

Off-the-shelf, pre-government Anti-tamper review greatly enhances product viability at much short design cycle time.

Defense-Grade with Full-Range Temperature Testing

For demanding applications, designers have a choice of Xilinx defense-grade devices with ruggedized packaging for protection against caustic cleaning processes and ‘tin-whiskering’. These devices are full-range temperature tested and qualified with anti-counterfeiting features.

The Xilinx Difference in Missiles and Munitions

Requirement Xilinx Device Feature Highlights
Differing Design Sizes
  • Rackage compatibility in logic density of up to 2M logic cells/FPGAs
Multi-Channel A/D Interfacing
  • MGTs used for JESD204A standard interfacing
  • ChipSync™ for serial LVDA convertors
  • Internal Analog Mixed Signal (AMS), with 1Msps 12-bit internal ADCs (7 series)
External Memory Interfaces
  • RLDRAM/DDR2/DDR3
  • QDRII/QDRII + SRAM
Low-Power Requirements
  • Power efficient 7 series devices (can be <5W per device)
Extended Temperature Ranges
  • Military temperature range: -55°C to 125°C
  • Industrial temperature range: -40°C to 100°C
  • Q temperature range: -40°C to 125°C
DSP Parallel Filtering/Processing
  • DSP throughput of up to 5112GMACS (symmetric FIR)
Security
  • Configuration bitstream encryption AES
  • Government approved IA
  • DoD 5200 series Anti-Temper compliant
CPU Interface
  • Supports PCIe® Gen1, Gen2, Gen3 protocols
Miniaturization
  • Bare die available for most products

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