Defense contractors and agencies need the power of programmability to develop state-of-the-art capabilities while leveraging design resources across platforms in the global missiles and munitions (M&M) market. For more than two decades, Xilinx has helped M&M project teams meet—and exceed—mission requirements with the flexibility and integration capabilities of FPGAs.
The broad Xilinx portfolio of commercial and defense-grade devices makes it easy to match the right product to each project. Clear migration paths let developers get started today with the latest 7 series devices including the Xilinx Zynq-7000 SoC family. With industry-leading levels of integration, Xilinx devices enable the rapid delivery of complex capabilities with reduced risk.
A Path to Next-Generation Missiles and Munition Applications
High-Performance, Ultra-Low-Power Signal Processing
Xilinx COTS and defense-grade devices meet the connectivity and power requirements for most M&M applications including guidance, control, targeting, and communications applications. Latest 7 series and Zynq SOC built on the statdefensee-of-the-art 28nm HPL process provide the ideal solutions:
Programmable System Integration
Integration of functions is continuing to increase. The 2x capacity of Virtex®-7 increase over competing solutions will push integration to new heights.
Increased System Performance
Increased performance of Virtex-7 allows greater situational awareness and improved target engagement envelope.
BOM Cost Reduction
- Scale device size/cost for different end-product derivatives
- Reduces BOM cost by 45% from V6 to V7
Total Power Reduction
On-gimbal electronics cannot be cooled by conventional means due to mechanical isolation and vacuum environment. 22% power reduction of 7 series over previous generations.
Accelerated Design Productivity & TTM
Off-the-shelf, pre-government Anti-tamper review greatly enhances product viability at much short design cycle time.
Defense-Grade with Full-Range Temperature Testing
For demanding applications, designers have a choice of Xilinx defense-grade devices with ruggedized packaging for protection against caustic cleaning processes and ‘tin-whiskering’. These devices are full-range temperature tested and qualified with anti-counterfeiting features.
The Xilinx Difference in Missiles and Munitions
|Requirement||Xilinx Device Feature Highlights|
|Differing Design Sizes||
|Multi-Channel A/D Interfacing||
|External Memory Interfaces||
|Extended Temperature Ranges||
|DSP Parallel Filtering/Processing||