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  • Program Tier: Certified

Missing Link Electronics, Inc.

  • Program Member Since: 2011
  • Certified Engineers: 4
    • San Jose, CA, US (Headquarters)
    • Neu-Ulm, DE, DE (Design Office)

Partner Information

Missing Link Electronics (MLE) is a Silicon Valley based technology company with offices in San Jose, CA and Neu-Ulm, Germany. We have been enabling key innovators in the automotive, government and aerospace, industrial, and test & measurement markets to build better Embedded Systems, faster. MLE accomplishes this by combining Open Source Linux with FPGAs: Linux because it provides a feature-rich software foundation, proven for applications with networking and/or storage connectivity; FPGAs because they can implement – almost – any I/O protocol and can deliver significant performance acceleration by offloading the CPUs through hardware implementation of software tasks at a reasonable cost of development.

Our company provides individual solutions in the field of software, firmware, and FPGA design services, specializing in USB connectivity, Mixed-Signal FPGA, Serial ATA (SATA) and Serial Attached SCSI (SAS) storage extension as well as network protocol acceleration.

We are a partner of leading electronic device and solution providers to provide unique value-added products and services to our customers. In collaboration with Xilinx and ASICS World Services, we developed our Zynq SATA Storage Extension (Zynq SSE) which is delivered as a complete reference design for the Xilinx Zynq-7000 All Programmable SoC. Moreover, MLE partners with Fraunhofer Heinrich-Hertz-Institute to provide to the market a TCP/IP & UDP network protocol acceleration platform (NPAP) which enables high bandwidth and low-latency communication for FPGA- and ASIC-based systems.

Member of reVISION Ecosystem

Products/Services

  • Embedded Products
  • Design Services
  • IP Cores

Markets Supported

  • Audio Video and Broadcast
  • Automotive
  • Data Center
  • Aerospace and Defense
  • Industrial
  • Medical
  • Test and Measurement
  • Wired Communications
  • Wireless Communications

Design Competencies

  • Digital Signal Processing
  • Embedded Application Development
  • Embedded Porting - BSP Extension
  • Embedded Processors
  • FPGA Design and Integration
  • FPGA Design Optimization
  • FPGA Timing Closure
  • Industry Certification and Compliance Testing
  • Machine Learning
  • PCB Design and Layout
  • RF and Analog Design
  • Image Sensor Fusion
  • Signal Integrity Design and Analysis
  • System Architecture

Maximum Service Scope

  • Turnkey - Full Product Realization

Engagement Model

  • Time and Materials
  • SOW-Based Fixed Bid Projects
  • Captive Engineering Resources at Partner and Customer Location
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