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  3. FPGAs & 3D ICs

fpgas

FPGA Leadership across Multiple Process Nodes

AMD offers a comprehensive multi-node portfolio to address requirements across a wide set of applications. Whether you are designing a state-of-the-art, high-performance networking application requiring the highest capacity, bandwidth, and performance, or looking for a low-cost, small footprint field-programmable gate array (FPGA) to take your software-defined technology to the next level, AMD FPGAs and 3D ICs provide you with system integration while optimizing for performance/watt.

Multi-Node Product Portfolio

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16nm

The combination of TSMC’s 16nm FinFET process with new UltraRAM and SmartConnect technologies enables AMD to continue delivering ‘More than Moore’s Law’ value to the market.

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20nm

AMD enhanced FPGA architecture that contains a step-function increase in both the amount of connectivity resources and the associated inter-die bandwidth in this second-generation 3D IC architecture. 

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28nm

Continuous innovation on the process node enables new devices with optimal performance at the lower power across product families to meet requirements for key applications..

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7 Series Lifecycle Extended Through at Least 2035

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45nm

AMD offers exceptional connectivity features such as high logic-to-pin ratios, small form-factor packaging, MicroBlaze™ soft processor, and a diverse number of supported I/O protocols. 

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