Based on the UltraScale architecture, the latest Virtex® UltraScale+ devices provide the highest performance and integration capabilities in a FinFET node, including the highest serial I/O at 58G and the highest signal processing bandwidth at 21.2 TeraMACs of DSP compute performance. They also deliver the highest on-chip memory density with up to 500Mb of total on-chip integrated memory, plus up to 8GB of HBM Gen2 integrated in-package for 460GB/s of memory bandwidth. Virtex UltraScale+ devices deliver significant capabilities with integrated IP for PCI Express, Interlaken, 100G Ethernet with FEC, and Cache Coherent Interconnect for Accelerators (CCIX). Xilinx All Programmable 3D ICs utilize stacked silicon interconnect (SSI) technology to break through the limitations of Moore’s law and deliver the capabilities to satisfy the most demanding design requirements. Third-generation 3D IC technology provides registered inter-die routing lines enabling >600 MHz operation, with abundant and flexible clocking. As the industry’s most capable FPGA family, the devices are ideal for applications ranging from 1+ Tb/s networking, smart NIC, machine learning, and Data Center Interconnect, to fully-integrated radar/early-warning systems.
|Programmable System Integration|
|Increased System Performance||
|BOM Cost Reduction||
|Total Power Reduction||
|Accelerated Design Productivity||
All comparisons based upon 28 nm Virtex-7 FPGAs
|System Logic Cells (K)||862||1,314||1,724||2,586||2,822||3,780||962||962||1,907||2,852|
|GTY 32.75 Gb/s Transceivers||40||80||80||120||96||128||32||32||64||96|
For FPGA designers looking to shorten design time and ensure scalability and re-use, Xilinx provides a comprehensive suite of solutions ranging from C-based design abstractions to IP plug-and-play to address bottlenecks in hardware development, system-level integration, and implementation.