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3D ICs

The Industry’s Only Homogeneous and Heterogeneous 3D ICs

Xilinx 3D ICs utilize stacked silicon interconnect (SSI) technology to break through the limitations of Moore’s law and deliver the capabilities to satisfy the most demanding design requirements. Xilinx homogeneous and heterogeneous 3D ICs deliver the highest logic density, bandwidth, and on-chip resources in the industry, breaking new ground in system-level integration.

Heterogeneous 3D FPGA

3D ICs Based on UltraScale Architecture

Xilinx UltraScale™ 3D ICs provide unprecedented levels of system integration, performance, bandwidth, and capability. Both Virtex® UltraScale 3D ICs and Kintex® UltraScale 3D ICs contain a step-function increase in both the amount of connectivity resources and the associated inter-die bandwidth in this second-generation 3D IC architecture. The big increase in routing and bandwidth and the new 3D IC wide memory optimized interface ensures that next-generation applications can achieve their target performance at extreme levels of utilization. Virtex UltraScale+ 3D ICs include all of the architectural innovations delivered with the UltraScale families and incorporate 16nm 3D transistors for a “3D-on-3D” step function increase in performance per watt, with optional HBM Gen2 memory.

Xilinx 3D IC Devices Utilize SSI Technology

Xilinx offers 19 3D IC devices in Virtex UltraScale+, Virtex UltraScale, Kintex UltraScale, and Virtex-7 families – thereby offering customers a broad range of resources and capabilities to match leading edge demands. The SSI devices shown below offer unprecedented FPGA capabilities and are ideal for applications such as next-generation wired communications, high-performance computing, medical image processing, and ASIC prototyping/emulation.

Xilinx 3D IC Devices

Virtex UltraScale+












Virtex UltraScale







Kintex UltraScale







Virtex-7 T







Virtex-7 XT







Virtex-7 HT








Enabling “More than Moore” System Scaling

Xilinx 3D IC devices utilize SSI technology, enabling high-bandwidth connectivity between multiple die and provide massive inter-die bandwidth-per-watt compared to multi-chip approaches.The devices consume lower power while enabling the integration of transceivers and on-chip resources within a single package. SSI technology leverages proven microbump technology combined with coarse pitch through-silicon vias (TSVs) on a passive (no transistors) 65 nm silicon interposer to deliver high reliability interconnect without performance degradation on one FPGA device. This breakthrough technology provides the next level of advanced system integration for applications that require high logic density and tremendous computational performance.

3D FPGA diagram

Developer Zone

For FPGA designers looking to shorten design time and ensure scalability and re-use, Xilinx provides a comprehensive suite of solutions ranging from C-based design abstractions to IP plug-and-play to address bottlenecks in hardware development, system-level integration, and implementation.

Xilinx's software development environments and embedded platforms offer a comprehensive set of familiar and powerful tools, libraries and methodologies.
Acceleration Zone
Xilinx UltraScale™ and UltraScale+ FPGAs are empowering hardware and application developers in many of the world’s largest and most innovative cloud computing services.
Xilinx devices take conventional programmable logic to an era of integrated programmable systems to capitalize on the benefit of System Integration.
Xilinx provides machine learning solutions including the development stacks and hardware platforms for deploying advanced and efficient neural networks, algorithms and applications.
Xilinx works closely with world class partners like The Mathworks™ and National Instruments™ to enable rapid system development with unrivaled levels of system performance.
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