|
Documentation
Low Cost AdvantageReduce Cost through System Integration 65nm ExpressFabric TechnologyXilinx 65nm triple-oxide process technology shrinks die size, increases performance, and reduces power consumption. ExpressFabric™ technology with Real 6-input LUT architecture and diagonally symmetric interconnect increases logic utilization and performance by reducing logic levels between registers and creating shorter, faster routing. Hard IPAbundant hard IP provides area and power-efficient implementation of key functions with guaranteed performance that simplifies the design and enables you to choose a smaller device.
Hard IP Area Saving Case StudyAs shown in Figure 1, the abundant hard IP in Virtex-5 FPGAs provides logic area efficiency that enables you to implement your design in a smaller, less expensive device.![]() Figure 1Power consumption and area required to implement a typical design including 8-lane PCIe endpoint. PackagingSparse chevron packaging simplifies PCB design and reduces manufacturing cost. The unique pinout reduces crosstalk to help eliminate costly board debug and redesign. On-substrate bypass capacitors eliminate hundreds of external capacitors to simplify PCB layout and routing and reduce PCB size. An enhanced pinout for independent I/O banks reduces PCB layer count for additional cost savings. SolutionsXilinx pre-engineered, pre-verified IP, development boards, and kits also increase productivity and reduce design time.
Conversion-free Cost-reduction Path for Volume Production
|