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Spartan/XL

DateName
10/26/2011 XCN11010 - Product Discontinuation Notice(PDF, ver 1.0.1, 267 KB )

To communicate that Xilinx is discontinuing Spartan®-XL FPGA, XC9500 In-System Programmable CPLD products, all Automotive IQ Family offerings of Spartan®-II FPGA products and CoolRunner™ XPLA3 CPLD products.

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Spartan/XL Data Sheets

DateName
06/26/2008 Spartan and Spartan-XL FPGA Families Data Sheet(PDF, ver 1.8, 770 KB )

Complete description and specifications for the 5V Spartan® and 3.3V Spartan-XL FPGA families.

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Spartan/XL Customer Notices

DateName
11/14/2002 XCU2000-03 - Addition of PPT as a Substrate Supplier(PDF, ver 1.0, 22 KB )
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08/30/1999 XCU089902 - New Marking for Spartan Series Devices (PDF, ver 1.0, 15 KB )
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07/16/2007 XCN07012 - License Plate Number (LPN) Added to All Customer Labels(PDF, ver 1.0, 164 KB )

Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product.

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08/07/2006 XCN05011 - Mold Compound & Die-Attach Epoxy Material Conversion(PDF, ver 2.0, 60 KB )

This notification describes a material set consolidation of mold compound and die-attach epoxy across various packages in all Xilinx device families. The new material set is already used in Xilinx RoHS-compliant products. There is no change to the form, fit, or function of the devices.

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07/01/1999 PDN99004 - Discontinuance of Die and Wafer Sales for all Xilinx Product Families(PDF, ver 1.0, 24 KB )
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03/05/2004 PDN2004-01: Low-Volume Members of the Spartan Product Families are Discontinued(PDF, ver 1.0, 46 KB )

PDN2004-01 announces the discontinuation of Low-Volume members of the Spartan™, Spartan™-XL, and Spartan™-II product families.

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12/06/2004 PCN2004-28 - Humidity Indicator Card (HIC) Change(PDF, ver 1.0, 161 KB )

Xilinx is changing from a 6 dot HIC to a 3 dot HIC to comply with industry standard dry packing requirements, JEDEC standard J-STD-033.

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12/06/2004 PCN2003-11 - Conversion to Green Material Set (Mold Compound and Die Attach Material)(PDF, ver 1.1, 72 KB )
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08/03/2000 PCN00003 - A Change in the die-attach material for all thermally enhanced BGA packages(PDF, ver 1.0, 20 KB )
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08/19/2003 Advisory 2003-02 - Change in BGA Shipping Trays(PDF, ver 1.0, 43 KB )

Xilinx is changing the primary supplier for Ball Grid Array (BGA) shipping trays from Peak to both Daewon and Kostat.

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04/26/2010 XCN10017 - Adding SUNRISE Plastics Industry Shipping Tray for 28mm x 28mm QFP Packages and 31mm x 31mm BGA Packages(PDF, ver 1.1, 213 KB )

To advice customers that Xilinx has added alternate shipping tray for 28mm x 28mm QFP packages and 31mm x 31mm BGA packages.

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12/07/2009 XCN09033 - Humidity Indicator Card (HIC) Change(PDF, ver 1.0, 67 KB )

To inform customers of a change to the Humidity Indicator Card (HIC). There is no change to the form, fit, or function.

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10/18/2010 XCN10016 - Product Discontinuation Notice(PDF, ver 1.0, 283 KB )

To communicate that Xilinx is discontinuing the original Spartan® and Virtex® FPGA products.

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07/25/2011 XCN11018 - Spartan, Virtex and CoolRunner Series Wire Bond BGA Packaging Material Source Addition(PDF, ver 2.0, 147 KB )

To communicate the addition of new supply sources for wire bond BGA package core and prepreg material for Spartan®/-XL/-II/-IIE/-3/-3E/-3A/-3AN/-3ADSP/-6, XC95XXX, XC95XXXXL, Virtex®, Virtex®-E, Virtex®-II/-ll Pro, and CoolRunner™ and CoolRunner™-II product.

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10/26/2011 XCN11010 - Product Discontinuation Notice(PDF, ver 1.0.1, 267 KB )

To communicate that Xilinx is discontinuing Spartan®-XL FPGA, XC9500 In-System Programmable CPLD products, all Automotive IQ Family offerings of Spartan®-II FPGA products and CoolRunner™ XPLA3 CPLD products.

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Spartan/XL Application Notes

DateName
10/02/2007 XAPP501 - Configuration Quick Start Guidelines(PDF, ver 1.5, 249 KB )

This application note discusses the configuration and programming options for Xilinx Complex Programmable Logic Device (CPLD), Field Programmable Gate Array (FPGA), and PROM families and demonstrates some of the most popular configuration methods used for each family. This document includes configuration quick start guidelines for the Virtex™, Spartan™, XPLA3, XC9500, and XC18V00 families.

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07/22/2003 XAPP126 - Data Generation and Configuration for Spartan Series FPGAs(PDF, ver 1.1, 138 KB )

This application note describes various methods to configure Spartan™ series FPGAs. Each configuration method is described in detail. Information on necessary software programs to run with input files required, output files produced, download cables used, and other hardware necessary to accomplish the task is discussed. This application note targets users who are new to Xilinx® devices and Alliance/Foundation series software tools and is intended to make the configuration and debugging flows easy to understand.

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03/22/1999 XAPP125 - Conserving Power With Auto Power Down Mode in Spartan-XL FPGAs(PDF, ver 1.1, 21 KB )

Power consumption plays an important role in battery-powered applications. Spartan™-XL FPGAs are designed with segmented routing, 3.3-V operation, and advanced process technology to meet the needs for low power and high performance. This application note shows how to reduce power consumption by selectively disabling portions of the design that are not required all the time. This approach is particularly useful for devices that must be operating at all times. This application note discusses different strategies for reducing the supply current incrementally for an operating device.

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03/22/1999 XAPP124 - Using Manual Power Down Mode With Spartan-XL FPGAs(PDF, ver 1.1, 26 KB )

Spartan™-XL FPGAs come equipped with a Power Down mode that permits an exceptionally low level of power consumption (ICCO = 100 µA typical), making the family ideal for portable battery-powered applications. This application note provides all the information needed for a designer to use Power Down mode effectively, including descriptions of the mode's common applications, internal functioning and electrical characteristics.

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04/20/2001 XAPP122 - The Express Configuration of Spartan-XL FPGAs(PDF, ver 3.0, 111 KB )

This application note provides information on how to perform Express configuration for the Spartan™-XL family. Express Mode uses an eight-bit-wide bus for fast configuration of Xilinx FPGAs. The steps of Express configuration are described, followed by detailed circuit implementation instructions.

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11/13/1998 XAPP098 - The Low-Cost, Efficient Serial Configuration of Spartan FPGAs(PDF, ver 1.0, 97 KB )

This application note describes how to achieve low-cost serial configuration for Spartan™/Spartan™-XL FPGA designs, including: taking advantage of unused resources in a design (thereby reducing cost), part count, memory size, and board space. The idle processing time of an on-board controller is used to load configuration data from an off-board source, which allows a Spartan design to be upgraded in the field by sending the bitstream over a network.

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11/24/1997 XAPP091 - Configuring Mixed FPGA Daisy Chains(PDF, ver 1.0, 26 KB )

Xilinx FPGAs can be configured in a common daisy chain structure, where the lead device generates CCLK pulses and feeds serial configuration information into the next downstream device, which in turn feeds data into the next downstream device, etc. There is no limit to the number of devices in a daisy chain, and XC3000™, XC4000™, Spartan™, and XC5200™-series devices can be mixed freely with only one constraint: the lead device must be a member of the highest order family used in the chain.

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11/24/1997 XAPP090 - FPGA Configuration Guidelines(PDF, ver 1.1, 58 KB )

These guidelines describe the configuration process for all members of the XC3000™, XC4000™, XC5200™, and Spartan™ FPGA devices and their derivatives. The average user need not understand or remember all these details, but should refer to the debugging hints when problems occur.

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11/24/1997 XAPP088 - I/O Characteristics of XL FPGAs(PDF, ver 1.0, 30 KB )

Data sheets describe I/O parameters in digital terms, providing tested and guaranteed worst-case values. This application note describes XC4000XL/XLA and Spartan™-XL I/O parameters in analog terms, giving the designer a better understanding of the circuit behavior. However, such parameters are not production-tested and are, therefore, not guaranteed.

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07/07/1996 XAPP052 - Efficient Shift Registers, LFSR Counters, and Long Pseudo-Random Sequence Generators(PDF, ver 1.1, 101 KB )

Shift registers longer than eight bits can be efficiently implemented in XC4000™ or Spartan™ series SelectRAM memory. Using Linear Feedback Shift Register (LFSR) counters to address the RAM makes the design even simpler. This application note describes 4- and 5-bit universal LFSR counters, very efficient RAM-based 32-bit and 100-bit shift registers, and pseudo-random sequence generators with repetition rates of thousands and even trillions of years, useful for testing and encryption purposes. The appropriate taps for maximum-length LFSR counters of up to 168 bits are listed.

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09/17/1996 XAPP051 - Synchronous and Asynchronous FIFO Designs(PDF, ver 2.0, 106 KB )

This application note describes RAM-based FIFO designs using the dual-port RAM in XC4000™ Series devices. Synchronous designs with a common read/write clock are described, as well as asynchronous designs with independent read and write clocks. Emphasis is on the fast, efficient and reliable generation of the handshake signals FULL and EMPTY, which determine design performance.

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11/16/1999 XAPP017 - Boundary Scan in XC4000/XC5200 Device(PDF, ver 3.0, 214 KB )

XC4000/XC5200/Spartan FPGA devices contain boundary scan facilities that are compatible with IEEE Standard 1149.1. This application note describes those facilities in detail, and explains how boundary scan is incorporated into an FPGA design.

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11/01/1995 XAPP015 - Using the XC4000 Readback Capability(PDF, ver 1.0, 58 KB )

This application note describes the XC4000/Spartan™ Readback capability and its use. Topics include: initialization of the Readback feature, format of the configuration and Readback bitstreams, timing considerations, software support for reading back FPGA devices, and Cyclic Redundancy Check (CRC).

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07/20/1998 XAPP119 - Adapting ASIC Designs for Use with Spartan FPGAs(PDF, ver 1.0, 57 KB )

Spartan™ FPGAs are an exciting alternative for implementing digital designs that, previously, would have employed ASIC technology. Pre-existing ASIC intellectual property can be adapted for use with Spartan devices by following a straightforward procedure. Each step of the procedure is explained in detail. Guidelines show how an ASIC design, in the form of an RTL-level HDL file, can be revised to take full advantage of the Spartan series capabilities, thereby achieving efficient, high-performance implementations.

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08/01/2001 XAPP120 - Spartan FPGAs--The Gate Array Solution(PDF, ver 2.0, 87 KB )

This application note discusses the enormous strides made by Spartan™ series FPGAs in terms of density and performance and how it should be viewed as the Gate Array replacement. The Spartan device family offers many of the features that are desired by Gate Array designers with the major advantage of programmability, which can prove to be the key factor in the success of the product.

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Spartan/XL Package Specifications

DateName
10/03/2006 TQ144 - Material Declaration Data Sheet (Standard TQFP)(PDF, ver 1.2, 81 KB )

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10/19/2006 PQ240 - Material Declaration Data Sheet (Standard PQFP)(PDF, ver 1.2.1, 84 KB )

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10/19/2006 PQ208 - Material Declaration Data Sheet (Standard PQFP)(PDF, ver 1.2.1, 109 KB )

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10/05/2006 PC84 - Material Declaration Data Sheet (Standard PLCC)(PDF, ver 1.2, 87 KB )

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02/26/2007 VQ100/VQG100 - Package Drawing (VQFP)(PDF, ver 1.2.1, 99 KB )
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06/18/2004 PQ240/PQG240 - Package Drawing (PQFP)(PDF, ver 1.2, 154 KB )
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06/18/2004 PQ208/PQG208 - Package Drawing (PQFP)(PDF, ver 1.2, 155 KB )
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01/15/2007 BGG256 - Material Declaration Data Sheet (Pb-free Plastic BGA)(PDF, ver 1.0, 37 KB )

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09/28/2006 CS144 - Material Declaration Data Sheet (Standard Laminate Chip Scale BGA)(PDF, ver 1.2, 81 KB )

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01/08/2007 BG256 - Material Declaration Data Sheet (Standard Plastic BGA)(PDF, ver 1.2.1, 79 KB )

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10/05/2006 CSG280 - Material Declaration Data Sheet (Pb-free Flex Tape Chip Scale BGA)(PDF, ver 1.0, 75 KB )

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10/05/2006 CS280 - Material Declaration Data Sheet (Standard Flex Tape Chip Scale BGA)(PDF, ver 1.0, 78 KB )

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10/19/2006 PQG240 - Material Declaration Data Sheet (Pb-free PQFP)(PDF, ver 1.2.1, 83 KB )

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10/19/2006 PQG208 - Material Declaration Data Sheet (Pb-free PQFP)(PDF, ver 1.2.1, 80 KB )

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09/28/2006 PCG84 - Material Declaration Data Sheet (Pb-free PLCC)(PDF, ver 1.2, 88 KB )

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09/28/2006 CSG144 - Material Declaration Data Sheet (Pb-free Laminate Chip Scale BGA)(PDF, ver 1.2, 85 KB )

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06/18/2004 PC84/PCG84 - Package Drawing (PLCC)(PDF, ver 1.2, 91 KB )
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12/05/2005 CS280/CSG280 - Package Drawing (Laminate Chip Scale BGA)(PDF, ver 1.0, 62 KB )
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11/29/2005 CS280/CSG280 - Package Drawing (Flex Tape Chip Scale BGA)(PDF, ver 1.2.2, 58 KB )
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05/31/2006 CS144/CSG144 - Package Drawing (Laminate Chip Scale BGA)(PDF, ver 1.1, 69 KB )
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01/15/2007 CS144/CSG144 - Package Drawing (Flex Tape Chip Scale BGA)(PDF, ver 1.3, 49 KB )
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03/19/2007 BG256/BGG256 - Package Drawing (Plastic BGA)(PDF, ver 1.3, 98 KB )
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09/23/2011 VQ100 - Material Declaration Data Sheet (Standard VQFP)(PDF, ver 1.3, 93 KB )

100% Material Declaration Data Sheet for VQ100 package

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11/18/2011 VQG100 - Material Declaration Data Sheet (Pb-free VQFP)(PDF, ver 1.3, 93 KB )

VQG100 - Material Declaration Data Sheet (Pb-free VQFP)

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Spartan/XL White Papers

DateName
02/27/2006 WP237 - What are OFFSET Constraints?(PDF, ver 1.0, 398 KB )

This paper discusses the overall purpose of OFFSET constraints, the specific paths that are covered by OFFSET constraints, and the differences between the OFFSET IN and OFFSET OUT constraints.

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05/12/2003 WP192 - SMT Package Rework(PDF, ver 1.0, 42 KB )

Surface Mount Technology (SMT) packages include the leaded family packages (Quad Flat Pack (QFP) and Plastic Leaded Chip Carrier (PLCC)) and the Ball Grid Array (BGA) packages. SMT rework can be necessary for any of the following reasons: assembly related defects, such as shorts, opens, wrong orientation, and solder ball defects; device/package related defects/failure analysis; and engineering change or system upgrade.

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10/22/2007 WP275 - Get your Priorities Right – Make your Design Up to 50% Smaller(PDF, ver 1.0.1, 239 KB )

This white paper describes a rarely noticed design technique that can make a difference in the size and the performance of your FPGA design. Control signals on FPGA flip-flops have a built-in priority. If you can learn to write code that is sympathetic to the priorities, the results will be rewarding. This white paper provides some simple VHDL and Verilog examples to explain key points.

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03/07/2008 WP276 - Programmable Development and Test(PDF, ver 1.0.1, 318 KB )

FPGAs can be configured with test applications during the development and production test stage. This white paper explores efficient options to help in product development and accelerate testing on the production line.

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03/07/2008 WP272 - Get Smart About Reset: Think Local, Not Global(PDF, ver 1.0.1, 414 KB )

Applying a global reset to your FPGA designs is not a very good idea and should be avoided. This is a controversial issue, so this white paper looks at the reasons why such a design policy should be considered.

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02/01/2008 WP273 - Performance + Time = Memory (Cost Saving with 3-D Design)(PDF, ver 1.0, 488 KB )

Operating logic at a higher rate than the processing rate allows operations to be achieved sequentially. As with a processor, logic is timeshared over multiple clock cycles. Memory holds values not being used on a given clock cycle. The FPGA can be considered to be a three-dimensional volume to be filled. "Performance + Time = Memory" is a strange formula, but when understood, it can often result in significantly lower cost implementations with Xilinx devices.

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